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| Document 563 Flyback Transformer For Freescale Semiconductor MC34670 PD Interface * Designed for 13 W IEEE 802.3af-compliant PoE applications * Operates with 36 - 80 Volts input * 1500 Vrms isolation between the primary and the secondary Core material Ferrite Terminations RoHS tin-silver over tin over nickel over phos bronze. Other terminations available at additional cost. Weight 6.3 g Ambient temperature -40C to +85C Storage temperature Component: -40C to +85C. Packaging: -40C to +80C Resistance to soldering heat Max three 40 second reflows at +260C, parts cooled to room temperature between cycles Moisture Sensitivity Level (MSL) 1 (unlimited floor life at <30C / 85% relative humidity) Failures in Time (FIT) / Mean Time Between Failures (MTBF) 38 per billion hours / 26,315,789 hours, calculated per Telcordia SR-332 Packaging 175 per 13 reel Plastic tape: 32 mm wide, 0.5 mm thick, 28 mm pocket spacing, 12.93 mm pocket depth PCB washing Only pure water or alcohol recommended Inductance Inductance DCR max (Ohms)4 Part Power at 0 A2 at Ipk3 1 number (W) 10% (H) min (H) pri bias sec DA2362-AL_ 13 127 114.3 0.222 0.405 0.039 1. When ordering, please specify packaging code: Leakage Turns ratio6 inductance5 max (H) pri : sec pri : bias 0.950 1 : 0.250 1 : 0.594 Ipk3 (A) 1.0 Output7 5 V, 2.6 A DA2362-ALD Packaging: D = 13 machine-ready reel. EIA-481 embossed plastic tape (175 parts per full reel). B = Less than full reel. In tape, but not machine ready. To have a leader and trailer added ($25 charge), use code letter D instead. 2. Inductance is for the primary, measured at 250 kHz, 0.2 Vrms, 0 Adc. 3. Peak primary current drawn at minimum input voltage. 4. DCR for the secondary is per winding. 5. Leakage inductance measured between pins 3 and 4 with secondary pins shorted. 6. Turns ratio is with the secondary windings connected in parallel. 7. Output of the secondary is with the windings connected in parallel. Bias winding output is 12 V, 20 mA. 8. Electrical specifications at 25C. Refer to Doc 362 "Soldering Surface Mount Components" before soldering. Dot above pin1 0.500 max 12,70 0.039 1,00 0.004 /0,10 0.699 max 17,75 3 Pri 4 2 Bias 1 Secondary windings to be connected in parallel on PC board 8 7 Sec 9 10 0.080 2,03 0.590 14,99 0.050 1,27 1 0.512 13,00 10 0.028 0,70 Recommended Land Pattern 1 0.530 max 13,46 0.098 2,50 5 6 Dimensions are in inches mm 0.098 2,50 Specifications subject to change without notice. Please check our website for latest information. Document 563 Revised 10/29/08 (c) Coilcraft, Inc. 2009 |
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